2026 PACK EXPO INTERNATIONAL at Chicago, USA., North Building, Booth N-5977 during OCT. 18–21!
2026/06/11
Yeu Chyuan Industrial, a leading hot melt solutions provider and manufacturer based in Taiwan, will participate in PACK EXPO International 2026, taking place from October 18–21 at McCormick Place, Chicago, USA.
At the exhibition, Yeu Chyuan will showcase its Professional Glue Gun Series, developed for packaging, assembly, manufacturing, and maintenance applications. Designed for durability, reliable adhesive performance, and operational efficiency, these tools help meet the demands of modern industrial environments.
We welcome packaging professionals, manufacturers, distributors, and industry buyers to visit our booth and explore our latest hot melt solutions.
Visit us at North Building, Booth N-5977.
At the exhibition, Yeu Chyuan will showcase its Professional Glue Gun Series, developed for packaging, assembly, manufacturing, and maintenance applications. Designed for durability, reliable adhesive performance, and operational efficiency, these tools help meet the demands of modern industrial environments.
We welcome packaging professionals, manufacturers, distributors, and industry buyers to visit our booth and explore our latest hot melt solutions.
Visit us at North Building, Booth N-5977.